Flx 2320 s manual

 · The FLX measures the deflection (bowing) of a wafer using a laser beam. The laser makes two complete passes across the wafer. An initial measurement reference, with no film, is required to calculate the deflection resulting from the thin film deposit. found in section of the User Manual. Measurements The FLX measures the deflection (bowing) of a wafer using a laser beam. The laser makes two complete passes across the wafer. An initial measurement reference, with no film, is required to calculate the deflection resulting from the thin film deposit. The collected and calculated data. The FLXS is a thin-film stress measurement instrument. It calculates film stress by measuring the change in radius of curvature of a substrate caused by the deposition of a thin film on the substrate.

The FLX measures the deflection (bowing) of a wafer using a laser beam. The laser makes two complete passes across the wafer. An initial measurement reference, with no film, is required to calculate the deflection resulting from the thin film deposit. FLXS Thermal Cycling. Performance. Maximum Scan Diameter. mm. Manual. 3D Mapping. Optional. 1 µm wafer thickness for 10,Å thin film 2 (1s): 1 x. FLX R. Toho FLXR Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that demand. accurate stress measurements on various films and substrates up to mm in diameter. Incorporating KLA-Tencor’s patented “Dual Wavelength”.

Toho FLXS Thin Film Stress Measurement Systems offer industry standard capabilities for mass production and research facilities that. Tool Features. The TOHO FLXR is a tool for measuring wafer bowing due to stress imparted by deposited thin films. This tool is capable of measuring. The FLXS determines stress by measuring the curvature change of pre- and post-film deposition. The stress calculation is based on Stoney's equation.